两层金属氧化物薄膜材料起到抗反射涂层(ARC)作用；其中，HfO 2 薄膜在紫外到近红外有着良好的透过率（>80）,与silicon晶格匹配好，具有较高的激光损伤阈值； HfO 2 薄膜中固定电荷（负电荷）会在silicon表面感应出正电荷，形成表面P区，起到PINimplant降低入射光线 ...

Hsinchu, Taiwan, July 20, 2015 – United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has entered volume production for ...

There is a forecast that the production capacity of high-bandwidth memory (HBM) by US-based Micron will be limited to around 20,000 wafers per month. This is about half of the level previously ...

From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...

PARIS — Alchimer SA, France-based provider of wet deposition processes for interconnections in 3D packaging applications, announced it has introduced a deposition process that is said to reduce cost ...

LONDON — Alchimer SA (Massy, France), a provider of wet deposition processes for semiconductor interconnects and 3-D through-silicon vias (TSV), has said it has found a way to eliminate the seed-layer ...

AUSTIN, TX--(Marketwired - May 30, 2014) - SACHEM is announcing the release of Reveal Etch™, a wet chemistry designed to enable a single-step silicon etch / TSV reveal process. SACHEM and Solid State ...

FLANDERS, N.J.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE:RTEC) announced today the sale of its first NSX ® 320 TSV Metrology System to CEA-Leti, a leading research organization based in ...